Electronic circuit module and method for fabrication thereof

Abstract

Provided is an electronic circuit module using a board having no cavity and a method for efficiently fabricating it. Electronic components are mounted on the front face of a module board 1, and an LSI chip 5 is die-bonded on the bottom face thereof in a bare-chip state with gold wires 8. Around the LSI chip 5, metal blocks 9 made of copper are mounted by soldering. The LSI chip 5, the gold wires 8, and the metal blocks 9 provided on the bottom face of the module board 1 are sealed with resin 10 with a motherboard-facing face 9a of each metal block 9 and a face 18 thereof flush with the corresponding side face of the module board 1 exposed from the resin 10. These exposed portions serve as electrode terminals when the module 11 is soldered to a motherboard. The module board 1 is obtained by cutting a sheet circuit board into individual unit module boards 1.

Dependencies are inferred from the claim text.