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US 2007/0178701 A1Published application
Method of processing a substrate
AssigneeKabushiki Kaisha Toshiba
InventorsGen Toyota, Atsushi Shigeta, Hiroyuki Yano
Life of this patent
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Abstract
There is disclosed a method of processing a substrate, which comprises applying a surfactant or a water soluble polymer agent onto a surface of a substrate to be processed, and sliding a circumferential portion of the substrate and a polishing member against each other to polish the circumferential portion of the substrate.
Claims3
1-18. (canceled)
A program of processing a substrate readable and executable by a computer, comprising:
- applying a surfactant or a water soluble polymer agent onto a surface of a substrate to be processed;
- and
- sliding a circumferential portion of the substrate and a polishing member against each other to polish the circumferential portion of the substrate.
Dependencies are inferred from the claim text.