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US 2007/0178688 A1Published application
Method for forming multi-layer bumps on a substrate
AssigneeFreescale Semiconductor, Inc.
InventorsHei Shiu, On Chau, Gor Lai
Life of this patent
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Abstract
A method for forming multi-layer bumps on a substrate includes depositing an adhesive or a flux on the substrate, depositing a first metal powder on the adhesive, and melting or reflowing the adhesive and first metal powder to form first bumps. An adhesive or a flux and a second metal powder are then deposited on the first bumps, and melted to form second bumps on the first bumps to form multi-layer bumps. The multi-layer bumps are formed without the need for any wet chemicals.
Claims20
A method for forming a bump on a substrate, comprising:
- depositing a first adhesive on the substrate;
- depositing a first metal powder on the first adhesive, wherein the first metal powder adheres to the first adhesive;
- and
- heating the first adhesive and the first metal powder to form a first bump on the substrate.
1 more element
A method for forming a multi-layer connector on a substrate, comprising:
- depositing a first adhesive and a first metal powder on the substrate;
- heating the first adhesive and the first metal powder to form a first bump;
- depositing a second adhesive and a second metal powder over the first bump;
- and
- heating the second adhesive and the second metal powder to form a second bump on the first bump, wherein the first bump and the second bump form the multi-layer connector.
2 more elements
Dependencies are inferred from the claim text.