Back to results
US 2007/0178666 A1Published application
Integrated circuit system with waferscale spacer system
AssigneeSTATS ChipPAC, Ltd.
InventorsByung Tai Do, Sung Uk Yang
Life of this patent
Estimating the term…
Abstract
An integrated circuit system is provided including forming integrated circuits on a wafer using a semiconductor manufacturing process; forming a waferscale spacer system on the integrated circuits on the wafer using the semiconductor manufacturing process; and singulating the wafer to have portions of the waferscale spacer system on the integrated circuits after singulation.
Claims20
An integrated circuit system comprising:
- forming integrated circuits on a wafer using a semiconductor manufacturing process;
- forming a waferscale spacer system on the integrated circuits on the wafer using the semiconductor manufacturing process;
- and singulating the wafer to have portions of the waferscale spacer system on the integrated circuits after singulation.
An integrated circuit system comprising:
- forming integrated circuits on a wafer using a semiconductor manufacturing removal process;
- depositing a spacer material on an active side of the integrated circuits on the wafer;
- forming a waferscale spacer system on the integrated circuits on the wafer by selectively removing portions of the spacer material using the semiconductor manufacturing removal process;
- and
- singulating the wafer to have portions of the waferscale spacer system on the integrated circuits after singulation.
2 more elements
An integrated circuit system comprising:
- a substrate;
- an integrated circuit attached to the substrate;
- and
- a waferscale spacer system on the integrated circuit.
1 more element
Dependencies are inferred from the claim text.