Double-gated non-volatile memory and methods for forming thereof
AssigneeFreescale Semiconductor, Inc.
InventorsCraig Swift, Thuy Dao, Michael Sadd
Life of this patent
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AssigneeFreescale Semiconductor, Inc.
InventorsCraig Swift, Thuy Dao, Michael Sadd
Estimating the term…
A method for making a semiconductor device comprises providing a first wafer and providing a second wafer having a first side and a second side, the second wafer including a semiconductor structure, a first storage layer, and a layer of gate material, wherein the first storage layer is located between the semiconductor structure and the layer of gate material and closer to the first side of the second wafer than the semiconductor structure. The method further includes bonding the first side of the second wafer to the first wafer and cleaving away a first portion of the semiconductor structure to leave a layer of the semiconductor structure after the bonding. The method further includes forming a second storage layer over the layer of the semiconductor structure and forming a top gate over the second storage layer.
A method of making a semiconductor device, the method comprising:
A method of forming a transistor, comprising:
A method, comprising:
Dependencies are inferred from the claim text.