Flip-chip semiconductor device and method for fabricating the same
AssigneeSiliconware Precision Industries Co., Ltd.
InventorsYih Jenn Jiang, Han Ping Pu, Cheng Hsu Hsiao
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Abstract
A flip-chip semiconductor device and a method for fabricating the same are provided. A first underfill material with a low Young's modulus is applied to corners of a chip mounting area defined on a substrate. A chip is mounted on and electrically connected to the chip mounting area by a plurality of conductive bumps, allowing the first underfill material to encapsulate corners of the chip. A second underfill material with a high Young's modulus is used to fill a gap between the chip and the substrate to protect the conductive bumps and support the chip.
Claims16
A method for fabricating a flip-chip semiconductor device, the method comprising the steps of:
- providing a substrate defined with at least one chip mounting area thereon and applying a first underfill material to corners of the chip mounting area;
- mounting and electrically connecting at least one chip to the chip mounting area of the substrate via a plurality of conductive bumps, wherein the first underfill material is disposed between corners of the chip and the substrate;
- and
- filling a second underfill material into a gap between the chip and the substrate.
A flip-chip semiconductor device comprising:
- a substrate defined with at least one chip mounting area thereon;
- at least one chips mounted on and electrically connected to the chip mounting area of the substrate by a plurality of conductive bumps;
- a first underfill material applied to corners of the chip mounting area and disposed between corners of the chip and the substrate;
- and
- a second underfill material filling a gap between the chip and the substrate.
Dependencies are inferred from the claim text.