Method of packaging semiconductor die
AssigneeFreescale Semiconductor, Inc.
InventorsAminuddin Ismail, Chee Foong, Ruzaini Ibrahim
Life of this patent
Estimating the term…
Abstract
A method of packaging a semiconductor die (10) includes providing a flip-chip die (10) with bump connections (12) on its bottom surface (14). An adhesive tape (18) is attached to a plate surface (16) and lead fingers (20) are formed on the tape (18). The die (10) is placed on the tape (18) such that the bumps (12) on the die (10) contact respective ones of the lead fingers (20) on the tape (18). A reflow process is performed on the die (10), the tape (18) and the plate (16), which forms C5 type interconnects. A mold compound (24) is formed over the die (10) and the tape (18), and then the tape (18) and the plate (16) are removed.
Claims20
A method of packaging a semiconductor die, comprising:
- providing a flip-chip die with bump connections on a bottom surface thereof;
- attaching an adhesive tape to a plate surface;
- forming lead fingers on the tape;
- placing the die on the tape, wherein the bumps on the die contact respective ones of the lead fingers on the tape;
- performing a reflow process on the die, the tape and the plate;
- performing a molding process, wherein a mold compound is formed over the die and the tape;
- and
- removing the tape and the plate, thereby forming a packaged semiconductor die.
A method of packaging a semiconductor die, comprising:
- providing a flip-chip die with bump connections on a bottom surface thereof;
- attaching an adhesive tape to a plate surface;
- forming lead fingers on the tape;
- placing the die on the tape, wherein the bumps on the die contact respective ones of the lead fingers on the tape;
- performing a reflow process on the die, the tape and the plate, wherein the bumps and the lead fingers melt during the reflow process and form controlled collapse chip carrier connection (C5) type interconnects when cooled;
- performing a molding process, wherein a mold compound is formed over the die and the tape;
- removing the tape and the plate, thereby forming a packaged die;
- and
- grinding the packaged die to expose a surface of the C5 type interconnects.
A method of packaging a semiconductor die, comprising:
- attaching an adhesive tape to a plate surface;
- forming lead fingers on the tape;
- forming a heat sink on the tape;
- providing a semiconductor IC die with bonding pads on a top surface thereof;
- placing a bottom surface of the die on the heat sink;
- electrically connecting respective ones of the die bonding pads with respective ones of the tape lead fingers with a plurality of wires, wherein the connections of the wires to the lead fingers are ball bonds;
- performing a reflow process on the die, the tape and the plate, wherein the ball bonds and the lead fingers melt during the reflow process and form controlled collapse chip carrier connection (C5) type interconnects when cooled;
- performing a molding process, wherein a mold compound is formed over the die and the tape;
- and
- removing the tape and the plate such that the heat sink and a surface of the C5 type interconnects are exposed.
Dependencies are inferred from the claim text.