Semiconductor wafer with rear side identification and method
AssigneeInfineon Technologies AG
InventorsStephan Bradl, Rainer Holmer
Life of this patent
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Abstract
A semiconductor wafer with rear side identification and to a method for producing the same is disclosed. In one embodiment, the rear side identification has a multiplicity of information regarding the monocrystalline and surface and also rear side constitution. A multiplicity of semiconductor device positions arranged in rows and columns are provided on the top side of the semiconductor wafer, an information chip being arranged at an exposed semiconductor device position, the information chip having at least the information of the rear side identification.
Claims27
A semiconductor wafer comprising:
- rear side identification having a multiplicity of information regarding monocrystalline, surface and rear side constitution;
- a top side having a multiplicity of semiconductor chip positions arranged in rows and columns;
- and
- an information chip being arranged at an exposed semiconductor chip position, the information chip having at least the information of the rear side identification.
The semiconductor wafer as claimed in claim, comprising wherein the metallization structure of the semiconductor wafer has in the edge region an antenna structure, which is electrically connected to the information chip, for electromagnetic coupling.
A method for producing a semiconductor wafer with a rear side identification having a multiplicity of information regarding the monocrystalline, surface and rear side constitution of the semiconductor wafer being arranged on the rear side of the semiconductor wafer, the method comprising:
- introducing a multiplicity of semiconductor chip structures in semiconductor chip positions which are arranged in rows and columns on the top side of the semiconductor wafer;
- introducing an information chip structure in an exposed semiconductor chip position of the top side of the semiconductor wafer;
- storing semiconductor identification data of the rear side identification and semiconductor process information of a production batch in the information chip of the information structure;
- and
- retrieving the semiconductor wafer identification and the semiconductor process information of a production batch stored in the information chip as required, after a thinning of the semiconductor wafer from its rear side.
A semiconductor wafer comprising:
- a top side, the top side having a multiplicity of semiconductor chip positions arranged in rows and columns;
- and
- an information structure in a semiconductor chip position, the information structure storing identification information and wafer process information.
A method comprising:
- providing a semiconductor wafer comprising a rear side and a top side, a rear side identification storing identification information and wafer process information, the rear side identification being arranged on the rear side of the semiconductor wafer, a multiplicity of semiconductor chip structures in semiconductor chip positions which are arranged in rows and columns on the top side of the semiconductor wafer and an information chip structure in a semiconductor chip position of the top side of the semiconductor wafer;
- retrieving the identification information and wafer process information from the rear identification;
- and
- storing the identification information and wafer process information from the rear identification in the information chip.
A semiconductor wafer comprising:
- a top side, the top side having a multiplicity of semiconductor chip positions arranged in rows and columns;
- and
- means for providing an information structure in a semiconductor chip position, the information structure storing identification information and wafer process information.
Dependencies are inferred from the claim text.