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US 2007/0178228 A1Published application
Method for fabricating a PCB
OwnerHei Shiu, On Chau +1inventors
InventorsHei Shiu, On Chau, Ho Wong
Life of this patent
Estimating the term…
Abstract
A method for forming a metal layer on a substrate begins by providing a resin film on the substrate. An organic photo conductor layer having charged and uncharged segments is adhered to the resin film. Metal powder is deposited onto the charged segments of the organic photo conductor layer after which it is heated to form the metal layer.
Claims20
A method of forming a metal layer on a substrate, comprising:
- providing a resin film on the substrate;
- providing an organic photo conductor layer on the resin film, wherein the organic photo conductor layer includes charged segments and uncharged segments;
- depositing a metal powder on the charged segments of the organic photo conductor layer;
- and
- heating the metal powder to form the metal layer.
2 more elements
A method for forming a metal layer on a substrate, comprising:
- providing a resin film on the substrate;
- providing an organic photo conductor layer, wherein the organic photo conductor has a charge;
- selectively removing charge from the organic photo conductor layer to form uncharged segments;
- depositing a metal powder on charged segments of the organic photo conductor layer, wherein the metal powder is attracted to the charged segments;
- depositing the organic photo conductor layer and the metal powder on the substrate;
- and
- heating the metal powder to form the metal layer.
4 more elements
A method for forming a metal layer on a substrate, comprising:
- providing a resin film on the substrate;
- providing an organic photo conductor layer on a drum of a laser printer;
- charging the organic photo conductor;
- selectively removing charge from the organic photo conductor layer to form charged segments and uncharged segments;
- depositing metal powder on the charged segments of the organic photo conductor layer;
- rotating the drum to deposit the organic photo conductor layer and the metal powder onto the substrate;
- and
- heating the metal powder to form the metal layer.
5 more elements
Dependencies are inferred from the claim text.