Printed circuit board
AssigneeEADS Deutschland GmbH
InventorMarcus Baertele
Life of this patent
Estimating the term…
Abstract
An arrangement for increasing the packing density on a printed circuit with surface mounted electrical components. The printed circuit is formed by two films which are pressed against one another with a dielectric arranged between them. At least one of the mutually opposite faces of the films are fitted with surface mounted electrical components. The via holes are provided in the printed circuit in order to connect the two films, with each via hole being a direct connection between the mutually opposite faces of the films.
Claims21
1-10. (canceled)
An arrangement for increasing a packing density on a printed circuit with surface mounted electrical components the printed circuit comprising:
- two films pressed against one another with a dielectric arranged between them;
- and
- at least one of mutually opposite faces of the films being fitted with surface mounted electrical components via holes being provided in the printed circuit-to connect the two films,
- wherein each via hole of the via holes are a direct connection between the mutually opposite faces of the films.
A process for fabricating a printed circuit, comprising:
- providing two films against one another, the two films having mutually opposite faces;
- arranging a dielectric between the two films;
- and
- fitting at least one of the mutually opposite faces of the films with surface mounted electrical components and via holes,
- wherein each via hole of the via holes are arranged in direct connection between the mutually opposite faces of the films.
Dependencies are inferred from the claim text.