Lead-free solder, solder joint product and electronic component

Abstract

This invention provides lead-free solders that have excellent oxidation resistance and can be plastically worked easily and well. The lead-free solders and molded products of the lead-free solders can provide solder joint products, particularly electronic components, which are highly reliable, for example, in mechanical strength and joint strength. The lead-free solders, solder joint product, and electronic component are as follows. A lead-free solder comprising a tin (Sn)-base alloy having a tantalum (Ta) content of not less than 0.005% by weight and not more than 2.0% by weight. A lead-free solder comprising a tin (Sn)-base alloy comprising not less than 0.005% by weight and not more than 2.0% by weight of tantalum (Ta) and not less than 0.1% by weight and not more than 10.0% by weight of zinc (Zn) with the balance consisting of tin (Sn) and unavoidable impurities. A lead-free solder comprising a tin (Sn)-base alloy comprising not less than 0.005% by weight and not more than 2.0% by weight of tantalum (Ta) and not less than 0.1% by weight and not more than 60.0% by weight of bismuth (Bi) with the balance consisting of tin (Sn) and unavoidable impurities. A lead-free solder comprising a tin (Sn)-base alloy comprising not less than 0.005% by weight and not more than 2.0% by weight of tantalum (Ta) and not less than 0.1% by weight and not more than 10.0% by weight of indium (In) with the balance consisting of tin (Sn) and unavoidable impurities. A lead-free solder comprising a tin (Sn)-base alloy comprising not less than 0.005% by weight and not more than 2.0% by weight of tantalum (Ta) and not less than 0.01% by weight and not more than 7.5% by weight of copper (Cu) with the balance consisting of tin (Sn) and unavoidable impurities. A lead-free solder comprising a tin (Sn)-base alloy comprising not less than 0.005% by weight and not more than 2.0% by weight of tantalum (Ta) and not less than 0.01% by weight and not more than 5.0% by weight of silver (Ag) with the balance consisting of tin (Sn) and unavoidable impurities. A lead-free solder comprising a tin (Sn)-base alloy comprising not less than 0.005% by weight and not more than 2.0% by weight of tantalum (Ta), not less than 0.01% by weight and not more than 5.0% by weight of silver (Ag), and not less than 0.01% by weight and not more than 7.5% by weight of copper (Cu) with the balance consisting of tin (Sn) and unavoidable impurities. A solder joint product produced by jointing with the above lead-free solder. An electronic component produced by jointing with the above lead-free solder.

Dependencies are inferred from the claim text.