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US 2007/0177364 A1Published application
High density surface mount part array layout and assembly technique
AssigneeMicrosoft Corporation
InventorsJelena Larsen, Chee Fong, Peter Atkinson, Raul Rodriguez-Montanez
Life of this patent
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Abstract
A printed wiring assembly comprising, a printed wiring board, a ball grid array coupled to the printed wiring board, and a high density surface mount part array disposed on the printed wiring board.
Claims20
A printed wiring assembly comprising:
- a printed wiring board;
- a ball grid array coupled to the printed wiring board;
- and
- a high density surface mount part array disposed on the printed wiring board in which the high density surface mount part array includes:
- a feed-through hole coupled to the end of a first printed wiring pad and to the end of a second printed wiring pad in an end to end configuration;
- a first chip capacitor having a first terminal coupled to the first printed wiring pad;
- a second chip capacitor having a first terminal coupled to the second printed wiring pad;
- and
- a solder paste disposed on the first printed wiring pad and the second printed wiring pad to couple the first terminal of the first chip capacitor to the first printed wiring pad and to couple the first terminal of the second chip capacitor to the second printed wiring pad.
6 more elements
A printed wiring assembly comprising:
- a printed wiring board;
- a ball grid array coupled to the printed wiring board;
- and
- a high density surface mount part array disposed on the printed wiring board in which the high density surface mount part array includes:
- a feed-through hole coupled to the side of a first printed wiring pad and to the side of a second printed wiring pad in a partial lateral configuration;
- a first chip capacitor having a first terminal coupled to the first printed wiring pad;
- a second chip capacitor having a first terminal coupled to the second printed wiring pad;
- and
- a solder paste disposed on the first printed wiring pad and the second printed wiring pad to couple the first terminal of the first chip capacitor to the first printed wiring pad and to couple the first terminal of the second chip capacitor to the second printed wiring pad.
6 more elements
A printed wiring assembly comprising:
- a printed wiring board means for mounting circuit components;
- a ball grid array means for packaging an IC, coupled to the printed wiring board means;
- a high density surface mount part array means for compactly bypassing power supply noise to ground, disposed on the printed wiring board;
- and
- a solder paste means for coupling a first terminal of a first chip capacitor to a first printed wiring pad and to couple a first terminal of a second chip capacitor to a second printed wiring pad.
2 more elements
Dependencies are inferred from the claim text.