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US 2007/0177335 A1Published application
Thermal interconnection for capacitor systems
AssigneeMaxwell Technologies, Inc.
InventorGuy Thrap
Life of this patent
Estimating the term…
Abstract
Thermal protection is provided in systems utilizing hi-current double-layer capacitors.
Claims27
A system, comprising:
- at least one double-layer capacitor;
- and
- an interconnection, the interconnection coupled to the at least one double-layer capacitor, the interconnection for carrying capacitor current to or from the a least one double-layer capacitor, the interconnection functionally coupled to the at least one double-layer capacitor to reduce a temperature of the at least one double-layer capacitor.
Dependencies are inferred from the claim text.