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US 2007/0177334 A1Published application
Thermal interconnection for capacitor systems
AssigneeMaxwell Technologies, Inc.
InventorGuy Thrap
Life of this patent
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Abstract
Thermal protection is provided in systems utilizing high-current double-layer capacitors.
Claims3
A method of reducing a double-layer capacitor temperature, comprising the steps of:
- providing one or more double-layer capacitor;
- coupling the one or more double-layer capacitor to an interconnection;
- passing a current through the interconnection and the double-layer capacitors;
- and
- using the interconnection to reduce a temperature of the double-layer capacitors based on a temperature external to the double-layer capacitor.
2 more elements
Dependencies are inferred from the claim text.