Thermal printhead
AssigneeRohm Co., Ltd.
InventorsMasaya Yamamoto, Shinobu Obata
Life of this patent
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Abstract
A thermal printhead (A) according to the present invention includes a substrate (1) having an obverse surface on which a glaze layer (2) is formed, an electrode (4) formed on the glaze layer (2) and a clip connector (5) attached to an edge of the substrate (1) for connection to an external device and connected to the electrode (4) via solder (8). An input wiring portion (33) as a buffer layer is provided between the glaze layer (2) and the electrode (4), and the input wiring portion (33) protrudes from the electrode (4) at least at an end adjacent to the edge of the substrate (1).
Claims11
A thermal printhead comprising:
- a substrate having an obverse surface formed with a glaze layer;
- an electrode formed on the glaze layer;
- and
- an external connection member attached to an edge of the substrate for connection to an external device and soldered to the electrode;
- wherein a buffer layer is interposed between the glaze layer and the electrode, the buffer layer protruding from the electrode at least at an end of the electrode that is adjacent to the edge of the substrate.
Dependencies are inferred from the claim text.