Flat-panel display devices and manufacturing method therefor
AssigneeToshiba Matsushita Display Technology Co., Ltd.
InventorShinichi Kawano
Life of this patent
Estimating the term…
Abstract
A flat-panel display device comprises: a display panel having a pixel area for matrix imaging; a plurality of driver IC chips mounted in a row on a fringe part of the display panel; extension wirings extended out from wirings within the pixel area and electrically connected to terminals of the driver IC chips; and a marking visible with naked eye, which is disposed between a group of the extension wirings connected to one of the driver IC chips and another group of the extension wirings connected to other one of the driver IC chips, and which indicates boundary between said one group and said another group of the extension wirings.
Claims4
A flat-panel display device comprising:
- a display panel having a pixel area for matrix imaging;
- a plurality of driver IC chips mounted in a row on a fringe part of the display panel;
- extension wirings extended out from wirings within the pixel area and electrically connected to terminals of the driver IC chips;
- and
- a marking visible with naked eye, which is disposed between a group of the extension wirings connected to one of the driver IC chips and another group of the extension wirings connected to other one of the driver IC chips, and which indicates boundary between said one group and said another group of the extension wirings.
A manufacturing method for the flat-panel display device, comprising:
- preparing a display panel that has a pixel area arrayed with pixel electrodes for matrix imaging and has extension wirings extended out from signal lines or scanning lines within the pixel area to a fringe part of the display area;
- mounting a plurality of driver IC chips on the fringe part;
- and
- inspecting whether every pixel of the display panel acts normally or not;
- and wherein
- said preparing the display panel comprises arranging of a marking visible with a naked eye between a group of the extension wirings connected to one of the driver IC chips and another group of the extension wirings connected to other one of the driver IC chips, as to indicate boundary between said one group and said another group of the extension wirings;
- and
- when said inspecting reveals a line defect and its virtual extension drawn out to the fringe part comes to a region between two adjacent ones of the driver IC chips, it is determined which one of said two adjacent ones of the driver IC chips is connected with wirings on the line defect, by use of the marking;
- and
- then the driver IC chip that is determined to be associated with the line defect is detached and new one is mounted as a replacement.
Dependencies are inferred from the claim text.