RF communication system with embedded antenna
AssigneeZeeWaves Systems, Inc.
InventorsKhurshid Qureshi, Scott Gruber
Life of this patent
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Abstract
Provided is a wireless RF communications system for use in electronic devices requiring a communication capability. The system, which may be positioned between any two surfaces or panels of the electronic device includes a printed circuit board (“PCB”), a radio module incorporated into the PCB, and at least one antenna embedded in the PCB. A microstrip transmission line interconnects the antenna and radio module. In at least one embodiment, the PCB is flexible. Reduced cost and enhanced performance are recognized through a synergistic manufacturing process wherein components are etched or otherwise placed in sequence or concurrently onto a single PCB, and interconnect cables are eliminated.
Claims21
An RF communication system comprising:
- a printed circuit board (“PCB”);
- a radio module incorporated into the printed circuit board;
- and
- at least one antenna embedded into the PCB and interconnected with the radio module;
- wherein the PCB, radio module and antenna are positioned between a front and a back surface of an electronic device.
An improved wireless RF communication system of the type in which a radio is embedded between a front and a back surface of an electronic device, the improvement comprising:
- a printed circuit board (“PCB”);
- a radio module incorporated into the PCB;
- at least one antenna embedded into the PCB and interconnected to the radio module;
- and
- a microstrip transmission line integrated into the PCB to interconnect the antenna and the radio module.
A method of manufacturing an RF communication system for an electronic device, comprising:
- incorporating a radio module into a printed circuit board (“PCB”);
- embedding at least one antenna into the PCB;
- interconnecting the antenna with the radio module;
- positioning the PCB, radio module, and antenna between a front and a back surface of the electronic device.
A wireless RF communication device, comprising:
- a transmit/receive means for receiving and transmitting RF signals;
- an RF processing means, interconnected to the transmit/receive means, for processing the RF signals;
- and
- an interconnecting means for interconnecting the transmit/receive means and processing means,
- wherein the transmit/receive means and processing means are integrated into a single printed circuit board (“PCB”) positioned between a front and a back surface of an electronic device.
Dependencies are inferred from the claim text.