Integrated circuit package, and a method for producing an integrated circuit package having two dies with input and output terminals of integrated circuits of the dies directly addressable for testing of the package

An integrated circuit package comprising:

• a first die having a first integrated circuit thereon, and at least one first input terminal to and a plurality of first output terminals from the first integrated circuit,
• a second die having a second integrated circuit thereon and a plurality of second input terminals to and at least one second output terminal from the second integrated circuit,
• at least one first external terminal accessible externally of the integrated circuit package,
• at least one second external terminal accessible externally of the integrated circuit package, and
• a switch circuit operable for selectively coupling the or each first external terminal to the one or a corresponding one of the first input terminals, the or each second external terminal to the one or a corresponding one of the second output terminals, and each second input terminal to a corresponding one of the first output terminals for normal operation of the integrated circuit package, the switch circuit being operable for facilitating selective testing of the first and second integrated circuits between selectable combinations of the first input terminal or terminals and the first output terminals and selectable combinations of the second input terminals and the second output terminal or terminals, so that a test signal applied to the one or one of the first external terminals is relayed to a selected one of the first and second input terminals of the selected one of the first and second integrated circuits, and a response signal to the test signal on a selected one of the first and second output terminals of the selected one of the first and second integrated circuits is relayed to the one or one of the second external terminals.

A method for producing an integrated circuit package comprising two dies with respective integrated circuits formed thereon, and with input and output terminals of the integrated circuits being directly addressable for facilitating testing of the integrated circuits, the method comprising:

• providing a first die of the two dies, the first die having a first integrated circuit thereon with a first input terminal to and a first output terminal from the first integrated circuit,
• providing a second die of the two dies, the second die having a second integrated circuit thereon with a second input terminal to and a second output terminal from the second integrated circuit,
• providing a first external terminal accessible externally of the integrated circuit package,
• providing a second external terminal accessible externally of the integrated circuit package, and
• providing a switch circuit operable for selectively coupling the first input terminal to the first external terminal, the second output terminal to the second external terminal, and the second input terminal to the first output terminal for normal operation of the integrated circuit package, the switch circuit being operable for facilitating selective testing of the first and second integrated circuits, so that a test signal applied to the first external terminal is relayed to the one of the first and second input terminals of the selected one of the first and second integrated circuits, and a response signal to the test signal on the one of the first and second output terminals of the selected one of the first and second integrated circuits is relayed to the second external terminal.

A method for producing an integrated circuit package comprising two dies with respective integrated circuits formed thereon, and with input and output terminals of the integrated circuits being directly addressable for facilitating testing of the integrated circuits, the method comprising:

• providing a first die of the two dies, the first die having a first integrated circuit thereon with at least one first input terminal to and a plurality of first output terminals from the first integrated circuit,
• providing a second die having a second integrated circuit thereon with a plurality of second input terminals to and at least one second output terminal from the second integrated circuit,
• providing at least one first external terminal accessible externally of the integrated circuit package,
• providing at least one second external terminal accessible externally of the integrated circuit package, and
• providing a switch circuit operable for selectively coupling the or each first external terminal to the one or to a corresponding one of the first input terminals, the or each second external terminal to the one or a corresponding one of the second output terminals, and each second input terminal to a corresponding one of the first output terminals for normal operation of the integrated circuit package, the switch circuit being operable for facilitating selective testing of the first and second integrated circuits between selectable combinations of the first input terminal or terminals and the first output terminals and selectable combinations of the second input terminals and the second output terminal or terminals, so that a test signal applied to the one or one of the first external terminals is relayed to a selected one of the first and second input terminals of the selected one of the first and second integrated circuits, and a response signal to the test signal on a selected one of the first and second output terminals of the selected one of the first and second integrated circuits is relayed to the second external terminal or to one of the second external terminals.