Probe For Semiconductor Devices
AssigneeFormFactor, Inc.
InventorsIgor Khandros, Gaetan Mathieu
Life of this patent
Estimating the term…
Abstract
An interconnection contact structure assembly including an electronic component having a surface and a conductive contact carried by the electronic component and accessible at the surface. The contact structure includes an internal flexible elongate member having first and second ends and with the first end forming a first intimate bond to the surface of said conductive contact terminal without the use of a separate bonding material. An electrically conductive shell is provided and is formed of at least one layer of a conductive material enveloping the elongate member and forming a second intimate bond with at least a portion of the conductive contact terminal immediately adjacent the first intimate bond.
Claims12
1-86. (canceled)
Resilient contact structures for electronic components, comprising:
- a plurality of resilient elongate elements each having a base end and a tip end, the base ends attached to corresponding ones of a plurality of contact pads on an electronic component, and
- a plurality of contact structures having a first side and a second opposite side, wherein ones of the plurality of contacts structures are attached on respective first sides to corresponding ones of the tip ends, and wherein at least a portion of each contact structure is comprised of rhodium.
Resilient contact structures for electronic components, comprising:
- a plurality of resilient elongate elements each having a base end and a tip end, the base ends attached to corresponding ones of a plurality of contact pads on an electronic component and wherein at least portions of the resilient elongate elements are comprised of rhodium.
Dependencies are inferred from the claim text.