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US 2007/0176615 A1Published application
Active probe contact array management
AssigneeXandex, Inc.
InventorRoger Sinsheimer
Life of this patent
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AssigneeXandex, Inc.
InventorRoger Sinsheimer
Estimating the term…
Methods and apparatus are described for controlling orientation of a probe contact array relative to a wafer contact array on a wafer. The probe contact array is configured on a probe card having first kinematic reference features associated therewith. The wafer is positioned in a wafer prober having an interface with second kinematic features. The first and second kinematic features are together operable to restrain relative motion between the probe card and the wafer prober when the probe card and the interface are docked. The orientation of the probe contact array relative to the wafer contact array is determined. Where the probe contact array is out of alignment with the wafer contact array, a height of at least one of the kinematic reference features is adjusted to bring the probe contact array and the wafer contact array into substantial alignment.
A method for controlling orientation of a probe contact array relative to a wafer contact array on a wafer, the probe contact array being configured on a probe card having first kinematic reference features associated therewith, the wafer being positioned in a wafer prober comprising an interface having second kinematic features associated therewith, the first and second kinematic features being together operable to facilitate alignment of the probe card to the interface and restrain relative motion between the probe card and the wafer prober when the probe card and the interface are docked, the method comprising:
A probe card for facilitating electrical contact with a wafer contact array on a wafer, the wafer being positioned in a wafer prober having an interface, the probe card comprising:
A wafer prober for facilitating testing of a wafer in conjunction with a probe card, the probe card having a probe contact array for contacting a wafer contact array on the wafer, the wafer prober comprising an interface having first kinematic reference features disposed thereon, the first kinematic reference features being operable together with second kinematic reference features associated with the probe card to facilitate alignment of the probe card to the interface and restrain relative motion between the probe card and the wafer prober when the probe card and the interface are docked, each of the first kinematic reference features being operable to move relative to the interface to facilitate alignment of the probe contact array with the wafer contact array.
A method for controlling planarity of a probe contact array in contact with a wafer contact array on a wafer, the probe contact array being configured on a probe card having first kinematic reference features associated therewith, the wafer being positioned in a wafer prober comprising an interface having second kinematic features associated therewith, the first and second kinematic features being together operable to facilitate alignment of the probe card to the interface and restrain relative motion between the probe card and the wafer prober when the probe card and the interface are docked, the method comprising:
Dependencies are inferred from the claim text.