Printed circuit board assembly and method of manufacturing the same
AssigneeSony Corporation
InventorsMinoru Ogawa, Kazuto Nishimoto
Life of this patent
Estimating the term…
Abstract
A printed circuit board assembly has plural printed circuit boards that are mechanically and electrically connected to each other with them being stacked, and a connection layer that connects the adjacent two printed circuit boards to each other is provided. The connection layer includes an insulation portion and an electric conduction portion. The insulation portion contains an insulating member and is adhered to each of the adjacent two printed circuit boards. The electric conduction portion passes through the insulation portion and connects electrode terminals of the adjacent two printed circuit boards.
Claims25
A printed circuit board assembly comprising:
- a plurality of printed circuit boards that are mechanically and electrically connected in a stacked arrangement;
- and
- a connection layer that connects the printed circuit boards adjacent to each, wherein the connection layer includes an insulation portion and an electric conduction portion, the insulation portion containing an insulating member and being adhered to each of the adjacent printed circuit boards, and the electric conduction portion passing through the insulation portion and connecting electrode terminals of the adjacent printed circuit boards.
A method of manufacturing a printed circuit board assembly containing a plurality of printed circuit boards and a connection layer,
- wherein the printed circuit boards are mechanically and electrically connected the connection layer in a stacked arrangement;
- wherein the connection layer includes an insulation portion and an electric conduction portion, the insulation portion being adhered to each of the printed circuit boards adjacent to each other and the electric conduction portion connecting electrode terminals of the adjacent printed circuit boards;
- and
- wherein the electric conduction portion includes an electrical conducting paste that contains a low-melting metal particle and a high-melting metal particle, the electrical conducting paste being coupled to metal other than the metal particles by using metallizing technology that connects metals to each other by applying predetermined pressure under a predetermined temperature, the method comprising:
- stacking the printed circuit boards to be connected via the connection layer at a predetermined position;
- clamping the printed circuit boards and the connection layer thus stacked by two plate-shaped elastic members;
- and
- applying a predetermined connection pressure to the printed circuit boards and the connection layer thus stacked by the two elastic members under a predetermined connection temperature to connect the printed circuit boards and the connection layer to each other.
Dependencies are inferred from the claim text.