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US 2007/0176317 A1Published application
Semiconductor device and method of manufacturing thereof
OwnerYoshitsugu Morita, Katsutoshi Mine +1inventors
InventorsYoshitsugu Morita, Katsutoshi Mine, Fumio Mitajima
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Abstract
A method of manufacturing a semiconductor device sealed with silicone rubber, characterized by 1) placing an unsealed semiconductor device into a mold, 2) thereafter filling in spaces between the mold and the semiconductor device with a sealing silicone rubber composition, and 3) subjecting the composition to compression molding. By the utilization of this method, a sealed semiconductor device is free of voids, and a thickness of a sealing silicone rubber can be controlled.
Claims10
A method of manufacturing a semiconductor device sealed with silicone rubber, characterized by
- 1) placing an unsealed semiconductor device into a mold,
- 2) thereafter filling in spaces between the mold and the semiconductor device with a sealing silicone rubber composition, and
- 3) subjecting the composition to compression molding.
Dependencies are inferred from the claim text.