Circuit device
OwnerMakoto Murai, Ryosuke Usui +3inventors
InventorsMakoto Murai, Ryosuke Usui, Tetsuro Sawai, Toshikazu Imaoka, Yasunori Inoue
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Abstract
A highly reliable circuit device is provided at low cost. The circuit device includes a semiconductor element electrically connected to a wiring layer (copper plate and plating film) and passive parts sealed by a molded resin layer. The wiring layer has a predetermined pattern formed by a conductive member. The molded resin layer has projections protruding from gaps in the adjacent wiring layer toward an underside of the wiring layer. Thereby, the drop of yield is prevented and the highly reliable circuit device is provided at low cost.
Claims4
A circuit device, comprising:
- a wiring layer;
- a circuit element provided above said wiring layer;
- and
- a molded resin layer which seals said circuit element, wherein there are provided projections, made of insulating material, which protrude from gaps in said wiring layer toward an underside of said wiring layer.
Dependencies are inferred from the claim text.