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US 2007/0176302 A1Published application
Low temperature co-fired ceramic module and method of manufacturing the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsTae Soo Lee, Yun Hwi Park, Taek Jung Lee
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Abstract
An LTCC module includes an LTCC substrate and a pad part formed on an undersurface of the LTCC substrate for mounting the LTCC substrate to an external substrate. The pad part includes a metal pad layer formed on an undersurface of the LTCC substrate and a solder layer formed on an undersurface of the metal pad layer.
Claims17
A Low Temperature Co-fired Ceramic (LTCC) module comprising:
- an LTCC substrate;
- and
- a pad part formed on an undersurface of the LTCC substrate for mounting the LTCC substrate to an external substrate,
- wherein the pad part comprises a metal pad layer formed on an undersurface of the LTCC substrate and a solder layer formed on an undersurface of the metal pad layer.
1 more element
A method of manufacturing a Low Temperature Co-fired Ceramic (LTCC) module comprising:
- forming a metal pad layer on an undersurface of an LTCC substrate for connection with an external substrate;
- and
- forming a solder layer on an undersurface of the metal pad layer.
Dependencies are inferred from the claim text.