Bonding pad structure
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHsien-Wei Chen, Hsueh-Chung Chen
Life of this patent
Estimating the term…
Abstract
Bonding pad structure is provided. The bonding pad structure comprises a semiconductor substrate having a top metal layer thereon, a first passivation layer formed on the semiconductor substrate and the top metal layer, and a bonding pad formed on the first passivation layer and connected to the top metal layer. The bonding pad structure further comprises a second passivation layer formed on the bonding pad and the first passivation layer and a solder bump or bond wire formed on the bonding pad and an upper surface of the second passivation layer, wherein at least one of the first passivation layer and the second passivation layer comprises a photosensitive polymer material.
Claims16
A bonding pad structure, comprising:
- a semiconductor substrate having a top metal layer thereon;
- a first passivation layer formed on the semiconductor substrate and comprising an opening exposing a portion of the top metal layer;
- a bonding pad formed on the first passivation layer and connected to exposed portion of the top metal layer;
- and
- a second passivation layer formed on the bonding pad and the first passivation layer, and comprising an opening exposing a portion of the bonding pad;
- and
- a solder bump formed on the exposed portion of the bonding pad and the second passivation layer;
- wherein at least one of the first passivation layer and the second passivation layer comprises a photosensitive polymer material.
A bonding pad structure, comprising:
- a semiconductor substrate having a top metal layer thereon;
- a first passivation layer formed on the semiconductor substrate and comprises an opening exposing a portion of the top metal layer;
- a bonding pad formed on the first passivation layer and connected to the exposed portion of the top metal layer;
- and
- a second passivation layer formed on the bonding pad and the first passivation layer, and comprising an opening exposing a portion of the bonding pad;
- and
- a bond wire formed on the exposed portion of the bonding pad;
- wherein at least one of the first passivation layer and the second passivation layer comprises a photosensitive polymer material.
Dependencies are inferred from the claim text.