Cascoded rectifier package

A semiconductor package, comprising:

• a substrate having a first conductive pad and a second conductive pad spaced and isolated electrically from said first conductive pad both pads disposed on a common surface;
• a III-nitride compound semiconductor component including two power electrodes, and a gate electrode;
• a diode arrangement connected at one pole thereof to one of said power electrodes through said first conductive pad and to said gate electrode at another one of said poles through said second conductive pad, whereby said diode arrangement and said compound semiconductor component are operatively connected to one another wirebondlessly.