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US 2007/0176288 A1Published application
Solder wall structure in flip-chip technologies
AssigneeInternational Business Machines Corporation
InventorsTimothy Daubenspeck, Jeffrey Gambino, Christopher Muzzy, Wolfgang Sauter
Life of this patent
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Abstract
A structure and method for forming the same. The semiconductor structure includes a first semiconductor chip and N solder bumps in direct physical contact with the first semiconductor chip, wherein N is a positive integer. The semiconductor structure also includes a first solder wall on a perimeter of the first semiconductor chip such that the first solder wall forms a closed loop surrounding the N solder bumps.
Claims20
A semiconductor structure, comprising:
- (a) a first semiconductor chip;
- (b) N solder bumps in direct physical contact with the first semiconductor chip, wherein N is a positive integer;
- and
- (c) a first solder wall on a perimeter of the first semiconductor chip such that the first solder wall forms a closed loop surrounding the N solder bumps.
1 more element
A semiconductor fabrication method, comprising:
- providing a first semiconductor chip;
- forming N solder bumps in direct physical contact with the first semiconductor chip, wherein N is a positive integer;
- and
- forming a first solder wall on a perimeter of the first semiconductor chip such that the first solder wall forms a closed loop surrounding the N solder bumps.
1 more element
A semiconductor structure, comprising:
- (a) a first semiconductor chip comprising a crack stop on a perimeter of the first semiconductor chip;
- (b) N solder bumps in direct physical contact with the first semiconductor chip, wherein N is a positive integer;
- (c) a first solder wall on a perimeter of the first semiconductor chip
- such that the first solder wall forms a closed loop surrounding the N solder bumps, and
- such that the first solder wall is overlapping the crack stop;
- and
- (d) a module substrate coupled to the first solder wall and the N solder bumps.
4 more elements
Dependencies are inferred from the claim text.