Thin integrated circuit device packages for improved radio frequency performance

A semiconductor package, comprising:

• a single non-conductive film layer defining opposed top and bottom film surfaces and a plurality of peripheral film side surfaces, the film layer including a plurality of vias disposed therein;
• a plurality of upper leads disposed on the top film surface adjacent respective ones of the vias;
• a plurality of lower leads disposed on the bottom film surface adjacent respective ones of the vias, each of the lower leads being electrically connected to a respective one of the upper leads;
• a plurality of transmission line elements disposed on the top film surface and electrically connected to at least one of the upper leads;
• and
• a package body encapsulating the upper leads and the transmission line elements, the package body being disposed on the top film surface and defining a plurality of generally vertical body side surfaces which are substantially coplanar with respective ones of the film side surfaces.

A semiconductor package comprising:

• a single non-conductive film layer defining opposed top and bottom film surfaces and a plurality of peripheral film side surfaces which extend generally perpendicularly between the top and bottom film surfaces;
• a plurality of upper leads disposed on the top film surface;
• a plurality of lower leads disposed on the bottom film surface, the film layer including means for electrically connecting each of the lower leads to a respective one of the upper leads;
• at least one transmission line element disposed on the top film surface and electrically connected to at least one of the upper leads;
• at least one semiconductor die attached to the top film surface and electrically connected to at least one of the upper leads and the transmission line element;
• and
• a package body encapsulating the semiconductor die, the upper leads and the transmission line element, the package body being disposed on the top film surface and defining a plurality of generally vertical body side surfaces and a generally horizontal body top surface which is substantially orthogonal to the body side surfaces.