Composite core circuit module system and method
AssigneeStaktek Group L.P.
InventorJames Wehrly
Life of this patent
Estimating the term…
Abstract
A circuit module is provided in which at least one secondary substrate and preferably two such secondary substrates are populated with integrated circuits (ICs). A rigid core substrate for the circuit module is comprised of a structural member and a connective member. In a preferred embodiment, the structural member is comprised of thermally conductive material while the connective member is comprised of conventional PWB material. The secondary substrate(s) are connected to the connective member with a variety of techniques and materials while, in a preferred embodiment, the connective member exhibits, in a preferred embodiment, traditional module contacts which provide an edge connector capability to allow the module to supplant traditional DIMMs.
Claims21
A circuit module comprising:
- a first secondary substrate, the first secondary substrate being populated with plural ICs;
- a rigid core composite substrate comprised of a connective member and a structural member, the structural member having a first lateral side and a second lateral side, along the first lateral side there being disposed the first secondary substrate, the connective member of the rigid core composite substrate exhibiting plural module contacts;
- and
- the first secondary substrate and the plural module contacts being connected.
The circuit module of claims 2 or 5 in which the at least one conductive assembly is comprised of plural pins.
A circuit module comprising:
- a first secondary substrate and a second secondary substrate, the first secondary substrate and the second secondary substrate each being populated with plural CSP memory devices;
- a rigid core composite substrate comprised of a connective member and a structural member, the structural member having a first lateral side and a second lateral side, along the first lateral side there being disposed the first secondary substrate, and along the second lateral side there being disposed the second secondary substrate, the connective member of the rigid core composite substrate exhibiting plural module contacts devised as edge connector contacts;
- and
- at least one conductive assembly comprised of pins that penetrate the connective member, the conductive assembly being connected to the first and secondary substrate.
Dependencies are inferred from the claim text.