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US 2007/0176285 A1Published application
Integrated circuit underfill package system
AssigneeSTATS ChipPAC, Ltd.
InventorsHyung Jun Jeon, Ki Youn Jang, Dae-Wook Yang
Life of this patent
Estimating the term…
Abstract
An integrated circuit underfill package system including providing a substrate having a dispense port, attaching a first integrated circuit die on the substrate, and supplying an underfill to the dispense port when the substrate and the first integrated circuit die are inverted.
Claims20
An integrated circuit underfill package system comprising:
- providing a substrate having a dispense port;
- attaching a first integrated circuit die on the substrate;
- and
- supplying an underfill to the dispense port when the substrate and the first integrated circuit die are inverted.
1 more element
An integrated circuit underfill package system comprising:
- forming a substrate having a dispense port, first electrical connections, and second electrical connections;
- mounting a first integrated circuit die having first electrical connectors on the substrate;
- dispensing an underfill to the dispense port and between the substrate and the first integrated circuit die when the substrate and the first integrated circuit die are inverted;
- curing the underfill between the substrate and the first integrated circuit die.
1 more element
An integrated circuit underfill package system comprising:
- a substrate having a dispense port;
- a first integrated circuit die on the substrate;
- and
- an underfill to the dispense port and between the substrate and the first integrated circuit die.
1 more element
Dependencies are inferred from the claim text.