Semiconductor package

A semiconductor package comprising:

• a substrate having a plurality of through holes for interconnecting electrically conductive traces formed on upper and lower surfaces of said substrate, said through holes being classified into a first set of through holes and a second set of through holes, said second set of through holes being located exterior of said first set of through holes and surrounding said first set of through holes;
• a die mounted on said upper surface of said substrate and connected electrically to said first set of through holes;
• a metal shield disposed on said upper surface of said substrate for enclosing said die therein and connected electrically to said second set of through holes, said metal shield further adapted to be connected to a common voltage source so as to protect said die from being disrupted by electromagnetic interference;
• and
• a molding resin for encapsulating said die and said metal shield on said substrate and filling a gap confined between said metal shield and said die.