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US 2007/0176279 A1Published application
Circuit board, semiconductor package having the same, and method of manufacturing the circuit board
AssigneeSamsung Electronics Co., Ltd.
InventorKil-Soo Kim
Life of this patent
Estimating the term…
Abstract
A circuit board may include an insulation plate having at least one slot. A first conductive pattern may be on the insulation plate. A plug may be on a sidewall of the slot, and may be electrically connected to the conductive pattern.
Claims27
A circuit board comprising:
- an insulation plate having at least one slot;
- a first conductive pattern on the insulation plate;
- and
- a plug in the insulation plate along a sidewall of the slot and electrically connected to the first conductive pattern.
1 more element
A method of manufacturing a circuit board, comprising:
- forming a first conductive pattern on an insulation plate;
- forming a plug through the insulation plate, the plug being electrically connected to the first conductive pattern;
- and
- exposing the plug by forming a slot through the insulation plate.
1 more element
Dependencies are inferred from the claim text.