Semiconductor module having a semiconductor chip stack and method
AssigneeInfineon Technologies AG
InventorsMarkus Brunnbauer, Markus Fink, Hans-Gerd Jetten
Life of this patent
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Abstract
A semiconductor module having a semiconductor chip stack and a method for producing the same is disclosed. In one embodiment, a thermally conductive layer with anisotropically thermally conductive particles is arranged between the semiconductor chips. The anisotropically thermally conductive particles have a lower thermal conductivity in a direction vertically with respect to the layer or the film than in a direction of the layer or the film.
Claims41
An integrated circuit comprising:
- a semiconductor chip stack comprising a plurality of semiconductor chips:
- and
- a thermally conductive layer arranged between the semiconductor chips, the thermally conductive layer including anisotropically thermally conductive particles having a lower thermal conductivity in a direction vertically with respect to the layer than in a direction of the layer.
A semiconductor module comprising:
- a semiconductor chip stack comprising a plurality of semiconductor chips:
- and
- a thermally conductive layer arranged between the semiconductor chips, the thermally conductive layer including anisotropically thermally conductive particles having a lower thermal conductivity in a direction vertically with respect to the layer than in a direction of the layer.
A film configured for the heat dissipation of a semiconductor chip stack, which is arranged between and/or above and/or below the semiconductor chip stack and comprises:
- anisotropically thermally conductive particles, the anisotropically thermally conductive particles having a lower thermal conductivity in a direction vertically with respect to the film than in a direction of the film.
A method for producing a semiconductor module comprising a semiconductor chip stack, the method comprising:
- producing of a wiring substrate with contact pads for flip-chip contacts of a lower semiconductor chip in the center of the wiring substrate and contact pads for at least one semiconductor chip to be stacked in edge regions of the wiring substrate;
- application of a lower semiconductor chip with flip-chip contacts in the center of the wiring substrate;
- applying lower heat conducting blocks having a height corresponding to the thickness of the lower semiconductor chip, to the edge regions of the wiring substrate whilst leaving free the contact pads for the semiconductor chip to be stacked;
- applying a film with an anisotropically thermally conductive layer to the lower semiconductor chips and the lower heat conducting blocks;
- stacking of a semiconductor chip on the film over the lower semiconductor chip;
- applying bonding connections between the stacked semiconductor chip and the contact pads in edge regions of the wiring substrate;
- applying upper heat conducting blocks in edge regions of the film, aligned with the lower heat conducting blocks;
- applying a thermally conductive covering to the upper heat conducting blocks.
A method for producing a semiconductor chip stack comprising:
- providing a plurality of semiconductor chips;
- applying a thermally conductive layer between one or more semiconductor chips to define a chip stack, the thermally conductive layer including anisotropically thermally conductive particles having a lower thermal conductivity in a direction vertically with respect to the layer than in a direction of the layer.
A semiconductor module comprising:
- a semiconductor chip stack comprising a plurality of semiconductor chips:
- and
- means for providing a thermally conductive layer arranged between the semiconductor chips, the thermally conductive layer including anisotropically thermally conductive particles having a lower thermal conductivity in a direction vertically with respect to the layer than in a direction of the layer
Dependencies are inferred from the claim text.