Card and Manufacturing Method
AssigneeVisioncard Personalisierungsgmbh
InventorRobert Wolny
Life of this patent
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Abstract
The invention relates to a card for contactless data and/or energy transmission by means of external devices, containing a multilayer card body which has a substrate layer for accommodating an antenna coil having exposed coil connections on a top side of the substrate layer which are connected in an electrically conductive manner to connections for a chip module containing a chip, the chip being enclosed in a recess in the substrate layer; the windings of the antenna coil extend on the top side of the substrate layer, and a compensation layer extends on the top side of the substrate layer; the compensation layer has a chip module opening for placing the chip module on the substrate layer, and has a bridge opening for the contacting of connections of an antenna bridge which extends transverse to the windings.
Claims10
A card for contactless and/or energy transmission by means of external devices comprising:
- a multilayer card body which has a substrate layer for accommodating an antenna coil having exposed coil connections on a top side of the substrate layer which are connected in an electrically conductive manner to connections for a chip module containing a chip, the chip being enclosed in a recess in the substrate layer, characterized in that the windings of the antenna coil extend on the top side of the substrate layer, and a compensation layer extends on the top side of the substrate layer facing the chip module, the compensation layer having a chip module opening for placing the chip module on the substrate layer, and having a bridge opening for the contacting of connections of an antenna bridge which extends transverse to the windings.
A method for manufacturing a card for contactless data and/or energy transmission by means of external devices comprising:
- a chip module which bears a chip being connected to a substrate layer which has an antenna coil, and connections for the chip module being connected in an electrically conductive manner to coil connections for the antenna coil, characterized in that a compensation layer is laminated to a top side of the substrate layer facing the chip module, the compensation layer having a chip module opening for placing the chip module on the substrate layer and having a bridge opening for the contacting of connections of an antenna bridge which extends transverse to the windings;
- the antenna bridge is applied to the compensation layer by screen printing;
- the chip module is positioned in the chip module opening by use of a nonconductive adhesive;
- and in a further step the connections for the chip module are contacted in an electrically conductive manner to the antenna connections by laminating the substrate layer to a lower cover layer which lies flat against the substrate layer, and laminating the compensation layer to an upper cover layer which lies flat against the compensation layer.
Dependencies are inferred from the claim text.