Semiconductor device and manufacturing method thereof
AssigneeYamaha Corporation
InventorsHiroshi Saitoh, Toshihisa Suzuki, Shingo Sakakibara
Life of this patent
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Abstract
A semiconductor device of the invention includes: a substrate having a hollowed hollow section on a top surface; a semiconductor chip mounted in the hollow section of the substrate; and a lid having a substantially plate-shaped top plate section that opposes the substrate and covers the hollow section, and having at least one pair of side wall sections that project from a circumference of the top plate section towards the substrate and that engage with a side surface of the substrate. The substrate and the lid can be accurately positioned
Claims25
A semiconductor device comprising:
- a substrate having a hollowed hollow section on a top surface;
- a semiconductor chip mounted in the hollow section of said substrate;
- and
- a lid having a substantially plate-shaped top plate section that opposes said substrate and covers said hollow section, and having at least one pair of side wall sections that project from a circumference of said top plate section towards said substrate and that engage with a side surface of said substrate.
A lid used on a semiconductor device configured with a semiconductor chip mounted on a top surface in the thickness direction of a substrate, which is covered via a hollowed hollow section, said lid comprising a substantially plate-shaped top plate section arranged opposing said hollow section, and at least one pair of side wall sections that project from a circumference of said top plate section towards said substrate and that engage with a side surface of said substrate.
A manufacturing method for a semiconductor device for manufacturing a semiconductor device in which a semiconductor chip mounted on one face in the thickness direction of a substrate, is covered by a conducting lid via a hollowed hollow section, comprising:
- a substrate plate member preparation step for forming a dividing base line for dividing a substrate plate on which a large number of said semiconductor chips are arranged in line on said one face in the thickness direction, into individual substrates;
- a lid preparation step for forming a large number of lids which individually cover said large number of semiconductor chips, positioned on one face of said substrate plate;
- an alignment step for overlapping and fixing said large number of lids on said one face side of each of said substrate plates so that said large number of lids cover each of said large number of semiconductor chips;
- and
- a dividing step for breaking said substrate plates from said dividing base line, and dividing into individual said semiconductor devices.
A semiconductor unit for manufacturing a semiconductor device in which a semiconductor chip mounted on one face in the thickness direction of a substrate, is covered by a conducting lid via a hollowed hollow section, comprising:
- a substrate plate member on which a large number of said semiconductor chips are arranged in line on said one face in the thickness direction;
- a plurality of lids which individually cover said large number of semiconductor chips, which are overlapped and fixed on one face side of said substrate plate member;
- and
- cutouts formed in said substrate plate member for dividing said substrate plate member into individual substrates.
Dependencies are inferred from the claim text.