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US 2007/0176271 A1Published application
Integrated circuit package system having die-attach pad with elevated bondline thickness
AssigneeSTATS ChipPAC, Ltd.
InventorsArnel Trasporto, Henry Bathan, Zigmund Camacho, Jeffrey Punzalan
Life of this patent
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Abstract
An integrated circuit package system is provided. A leadframe is provided having a die-attach pad. Elevated buttons are formed on the top surface of the die-attach pad configured to support an IC die in an elevated position thereon.
Claims20
An integrated circuit package system, comprising:
- providing a leadframe having a die-attach pad;
- and
- forming elevated buttons on the top surface of the die-attach pad configured to support an IC die in an elevated position thereon.
An integrated circuit package system, comprising:
- providing a leadframe having a die-attach pad;
- forming elevated buttons on the top surface of the die-attach pad configured to support an IC die in an elevated position thereon free of contact with lead fingers on the leadframe;
- attaching an IC die to the die-attach pad supported by the elevated buttons spaced above the top surface of the die-attach pad;
- and attaching bond wires between the IC die and lead fingers on the leadframe.
1 more element
An integrated circuit package system, comprising:
- a leadframe having a die-attach pad;
- and
- elevated buttons on the top surface of the die-attach pad configured to support an IC die in an elevated position thereon.
An integrated circuit package system, comprising:
- a leadframe having lead fingers and a die-attach pad;
- elevated buttons on the top surface of the die-attach pad configured to support an IC die in an elevated position thereon free of contact with the lead fingers;
- an IC die attached to the die-attach pad supported by the elevated buttons spaced above the top surface of the die-attach pad;
- and
- bond wires attached between the IC die and the lead fingers on the leadframe.
2 more elements
Dependencies are inferred from the claim text.