Socketless planar semiconductor module
AssigneeSamsung Electronics Co., Ltd.
InventorsJong-Joo Lee, Moon-Jung Kim
Life of this patent
Estimating the term…
Abstract
A semiconductor module may include a printed circuit board that may have a first surface, a second surface, and at least one fixture hole. A semiconductor device may be mounted on the first surface of the printed circuit board. At least one connection terminal may be provided on one of the first surface or the second surface of the printed circuit board that may connect with connection pads of a motherboard. The printed circuit board may be connected to the motherboard through the at least one fixture hole such the connection terminals may be aligned with the connection pad and one of the first surface and second surface of the printed circuit board may face a major surface of the motherboard.
Claims19
A socketless planar semiconductor module comprising:
- a printed circuit board having a first surface, a second surface and at least one fixture hole;
- at least one first semiconductor device mounted on the first surface of the printed circuit board;
- and
- at least one connection terminal provided on one of the first surface and the second surface of the printed circuit board to connect to a motherboard at a connection pad,
- wherein the printed circuit board connects to the motherboard through the at least one fixture hole such the connection terminals align with the connection pad and one of the first surface and second surface of the printed circuit board face a major surface of the motherboard.
Dependencies are inferred from the claim text.