Semiconductor device
AssigneeRenesas Technology Corp.
InventorsKenya Kawano, Kisho Ashida, Naotaka Tanaka, Hiroshi Sato, Ichio Shimizu
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Abstract
The present invention provides a semiconductor device capable of suppressing degradation in connection reliability due to the decrease in thickness of a conductive adhesive caused by the movement of a connecting plate in a semiconductor device to which a power transistor is mounted. A step is provided in the thin part of the connecting plate connected to a lead post to lock the connecting plate by contacting the step to the tip of the lead post. Alternatively, a groove is provided in the thin part of the connecting plate to lock the connecting plate by connecting the lead post to only the part of the connecting plate on the tip side from the groove.
Claims12
A semiconductor device comprising a connecting plate which electrically connects a first electrode and a second electrode,
- wherein a step is provided in a connection portion of said connecting plate where said connecting plate is connected to said first electrode or said second electrode, said first electrode or said second electrode and said step are connected by a conductive adhesive, and said connecting plate is locked to said first electrode or said second electrode by said step.
A semiconductor device comprising a connecting plate which electrically connects a first electrode and a second electrode,
- wherein a groove is provided in a connection portion of said connecting plate where said connecting plate is connected to said first electrode or said second electrode, said first electrode or said second electrode and an area of the connecting plate outside said groove are connected by a conductive adhesive, and said connecting plate is locked to said first electrode or said second electrode.
A semiconductor device comprising:
- a semiconductor chip having a main surface and a rear surface which are in opposite sides to each other, a first electrode provided on said rear surface and a second electrode provided on said main surface;
- a supporting substrate to which the first electrode of said semiconductor chip is bonded via a first adhesive;
- a lead disposed around said semiconductor chip;
- and
- a connecting plate bonded to the second electrode of said semiconductor chip via a second adhesive and to said lead via a third adhesive,
- wherein a step for suppressing movement of said connecting plate toward a lead side due to wetting and spreading and condensation of said third adhesive is provided in said connecting plate.
A semiconductor device comprising:
- a semiconductor chip having a main surface and a rear surface which are in opposite sides to each other, a first electrode provided on said rear surface and a second electrode provided on said main surface;
- a supporting substrate to which the first electrode of said semiconductor chip is bonded via a first adhesive;
- a lead disposed around said semiconductor chip;
- and
- a connecting plate bonded to the second electrode of said semiconductor chip via a second adhesive and to said lead via a third adhesive,
- wherein a groove for suppressing movement of said connecting plate toward a lead side due to wetting and spreading and condensation of said third adhesive is provided in said connecting plate.
Dependencies are inferred from the claim text.