Optical semiconductor device and circuit
AssigneeStanley Electric Co., Ltd.
InventorHiroyuki Takayama
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AssigneeStanley Electric Co., Ltd.
InventorHiroyuki Takayama
Estimating the term…
A surface mount optical semiconductor device and circuit can efficiently transfer and dissipate heat even when being mounted together with electronic circuit components. The optical semiconductor device can include a lead frame having a concave portion for mounting a light-emitting element therein and a pair of electrode terminals connected to a board. A sealing resin portion can be provided for sealing a surrounding region of the concave portion. A bottom surface of the concave portion is located at a predetermined distance from a connecting surface on which the pair of electrode terminals is connected to the board. The bottom surface of the concave portion can also be exposed from a bottom surface of the sealing resin portion. Thus, the bottom surface of the concave portion and the device in general can be air-cooled efficiently.
An optical semiconductor device comprising:
An electric circuit device comprising:
Dependencies are inferred from the claim text.