Structure for integrating LED circuit onto heat-dissipation substrate
OwnerWay-Jze Wen, Yi-Fong Lin +5inventors
InventorsWay-Jze Wen, Yi-Fong Lin, Shyi-Ming Pan, Chih-Wei Chiang, Yin-Cheng Chu, Huan-Che Tseng, Fen-Ren Chien
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Abstract
A structure for integrating LED circuit onto a heat-dissipation substrate is disclosed. At least an electronic component and a LED chip are integrated on a heat-dissipation substrate. The electronic component can be a passive component, a drive chip, an electrostatic discharge protection device, or a sensing component. Therefore, both wire-bonding area of the LED chip and the series resistance of wires are reduced while the heat dissipation efficiency is enhanced.
Claims22
A structure for integrating light emitting diode circuit onto a heat dissipation substrate comprising:
- a light emitting diode chip;
- and
- a heat dissipation substrate that connects with the light emitting diode chip and includes at least one electronic component;
- wherein an insulating layer and a circuit layer are sequentially disposed on the heat dissipation substrate while the circuit layer is electrically connected with the light emitting diode chip as well as the electronic component.
A structure for integrating light emitting diode circuit onto a heat dissipation substrate comprising:
- a light emitting diode chip;
- and
- a heat dissipation substrate connected with the light emitting diode chip and disposed with at least one electronic component.
Dependencies are inferred from the claim text.