Back to results
US 2007/0176142 A1Published application
Metal- polishing liquid and chemical-mechanical polishing method using the same
AssigneeFUJIFILM Corporation
InventorMakoto Kikuchi
Life of this patent
Estimating the term…
Abstract
A metal-polishing liquid contains at least one heterocyclic compound having from one to three nitrogen atom as heteroatoms in a molecule; and colloidal silica having a surface partially covered with aluminum. A chemical-mechanical polishing method contains processes of supplying the metal-polishing liquid to a polishing pad on a polishing platen; rotating the polishing platen; relatively moving the polishing pad while the polishing pad is contacted with a surface to be polished of an object to be polished; and polishing the surface to be polished of the object to be polished.
Claims18
A metal-polishing liquid comprising:
- at least one heterocyclic compound having from one to three nitrogen atom as heteroatoms in a molecule, and
- colloidal silica having a surface partially covered with aluminum.
Dependencies are inferred from the claim text.