Electronic component mounting method and electronic component mounting device
AssigneePanasonic Corporation
InventorsYoshiyuki Wada, Tadahiko Sakai
Life of this patent
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Abstract
In order to mount an electronic component, a connection terminal of the electronic component is bonded to electrodes of a substrate. This is done by using solder paste which mixes solder particles in a thermosetting adhesive. The solder paste is supplied to the electrodes and a recess. Solder print parts are formed. The electronic component is mounted and the connection terminal and the main body of the electronic component are adhered to the solder print parts, and are heated in this state by reflow. As a result, the connection terminal and the electrodes are bonded by a solder junction.
Claims6
An electronic component mounting method for mounting the electronic component on a substrate by soldering a connection terminal of the electronic component to an electrode provided on the substrate, comprising an adhesive supplying step of supplying a thermosetting adhesive mixing solder particles to the substrate, a component mounting step of mounting the electronic component on the substrate after the adhesive supplying step, and a heating step of heating the substrate after the component mounting step,
- wherein the adhesive supplying step is characterized by supplying the adhesive to the electrode, and also supplying the adhesive to an adhesion reinforcing portion determined outside of the electrode on the substrate,
- the component mounting step is characterized by fitting the connection terminal to the adhesive supplied on the electrode, and also fitting the electronic component to the adhesive supplied in the adhesion reinforcing portion, and
- the heating step is characterized by forming a solder junction by bonding the connection terminal and electrode by fusing the solder particles in the adhesive supplied to the electrode, and also forming an adhesion reinforced part for fixing the electronic component to the substrate by heating and curing the adhesive by sealing the inside of the adhesive with solder part by fusing and solidifying of solder particles contained in the adhesive supplied in the adhesion reinforcing portion.
An electronic component mounting structure for mounting an electronic component having a connection terminal on a substrate with an electrode by a thermosetting adhesive mixing solder particles, comprising:
- a soldering unit of bonding the electrode and the connection terminal formed by fusing and solidifying of the solder particles in the adhesive supplied in the electrode, and
- an adhesion reinforcing unit for fixing the electronic component to the substrate by heating and curing of adhesive, by sealing the inside of adhesive with a solder part formed by fusing and solidifying of the solder particles in the adhesive, being formed in the adhesion reinforcing portion separated from the electrode portion on the substrate.
Dependencies are inferred from the claim text.