Thickness distribution control for electroplating
AssigneeSiPix Imaging, Inc.
InventorsGary Kang, Yi-Shung Chaug
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Abstract
The invention is directed to an assembly for electroplating comprising an electroplating bath and non-conductive plates. The invention is also directed to an assembly for electroplating comprising an electroplating bath, elements with electrically adjustable resistance, and ampere-hour meters. The invention is further directed to methods for monitoring, controlling and adjusting the thickness distribution of an electroplated material on an object. The object can be of any shape as long as it can electrically charged.
Claims16
An assembly for electroplating, which assembly comprises:
- a) an electroplating bath in which an object to be electroplated and multiple anodes are immersed wherein said object acts as a cathode;
- and
- b) non-conductive plates placed between said object and said anode(s) wherein the position of said non-conductive plates is individually adjustable to control the area of coverage of said anodes.
An assembly for electroplating, which assembly comprises:
- a) an electroplating bath in which an object to be electroplated and multiple anodes are immersed and said object acts as a cathode;
- b) elements with electrically adjustable resistance which are individually and directly or indirectly connected to each of said anodes;
- and
- c) ampere-hour meters which are individually connected to the elements with electrically adjustable resistance.
A method for monitoring, controlling and adjusting the thickness distribution of an electroplated material on an object in an electroplating process, which method comprises:
- a) immersing in an electroplating bath multiple anodes and an object to be electroplated and to act as a cathode;
- b) providing non-conductive plates placed between said object and said anodes;
- and
- c) adjusting individually the position of said non-conductive plates to control the area of coverage of said anodes.
A method for monitoring, controlling and adjusting the thickness distribution of an electroplated material on an object in an electroplating process, which method comprises:
- a) immersing in an electroplating bath multiple anodes and an object to be electroplated and to act as a cathode;
- and
- b) providing elements with electrically adjustable resistance which are individually connected to each of said anodes.
Dependencies are inferred from the claim text.