Sputter target utilization
AssigneeOc Oerlikon Balzers AG
InventorsStefan Schneider, Marcel Muller, Jiri Vyskocil, Israel Wagner
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Abstract
An apparatus and method are provided for improved utilization of a sputter target in the longitudinal end regions. The focus of erosion in the end regions is widened, thereby extending the useful life of the target. This provides improved efficiency and reduces waste because a greater proportion of the target material in the more expansive central region can be harvested, because the target is utilized for a longer period of time.
Claims24
A sputtering apparatus comprising a magnetic assembly over which a sputter target having a central region and first and second longitudinal end regions is to be disposed during operation, said magnetic assembly being effective to generate a magnetic field above said target, said magnetic assembly having an outer magnet frame surrounding a central magnet arrangement, said outer magnet frame comprising first and second longitudinally extending magnetic lateral members located on either side of the central magnetic arrangement, and first and second magnetic end members located at and defining opposite longitudinal ends of said frame, said first magnetic end member being effective to produce a nonstatic modulation in said magnetic field above said first longitudinal end region of said target.
A sputtering method comprising the steps of:
- providing a sputter target having a target surface that has a central region and first and second longitudinal end regions located at either end of the central region, generating a magnetic field above said target surface, directing a plasma toward said target surface via said magnetic field, said plasma eroding said target surface, and modulating said magnetic field above said first end region of said target surface, thereby widening a focus of erosion of said target in said first end region thereof.
Dependencies are inferred from the claim text.