Multilayer printed circuit board and manufacturing method thereof
AssigneeFujitsu Limited
InventorNobutaka Itoh
Life of this patent
Estimating the term…
Abstract
A printed circuit board includes a product portion and a backing plate. Upper and lower surfaces of the backing plate are coated with solder masks with different material characteristics.
Claims10
A multilayer printed circuit board that includes a conductive circuit pattern and an electronic component, the multilayer printed circuit board comprising:
- a backing plate that includes a first surface and a second surface and that is to be removed-away during manufacturing process of the multilayer printed circuit board, at least one of the first surface and the second surface being coated with a solder mask;
- and
- a product portion for mounting the electronic component and at least partially surrounded by the backing plate.
A multilayer printed circuit board that includes a plurality of conductive circuit patterns and an electronic component, the multilayer printed circuit board comprising:
- a backing plate that includes a first surface and a second surface and that is to be removed-away during manufacturing process of the multilayer printed circuit board;
- a product portion for mounting the electronic component and at least partially surrounded by the backing plate;
- and
- a reinforcing member that is arranged in a portion where less number of the conductive circuit patterns are present.
A manufacturing method of a multilayer printed circuit board that includes a product portion and a backing plate, the manufacturing method comprising:
- forming a circuit pattern on the product portion;
- mounting an electronic component on the product portion;
- and
- applying solder masks with different material characteristics to a first surface and a second surface of the backing plate.
Dependencies are inferred from the claim text.