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AssigneeSiemens Aktiengesellschaft
InventorsFranz Auerbach, Bernd Gutsmann, Thomas Licht, Norbert Seliger, Kart Weidner, Jorg Zapf
Estimating the term…
In an arrangement having at least one substrate, at least one electrical component is disposed on a surface section of the substrate and is provided with an electrical contact area, and at least one electrical contact lug has an electrical connecting area electrically contacting the contact area of the component. The connecting area of the contact lug and the contact area of the component are interconnected so that at least one zone of the contact lug protrudes beyond the area of the component. The contact lug is provided with at least one electrically conducting film while the electrically conducting film is provided with the electrical connecting area of the contact lug. The arrangement is particularly useful for large-area, low-inductive contacting of power semiconductor chips, as it allows for high current density.
1-21. (canceled)
An arrangement, comprising:
A method of producing an arrangement of at least one electrical component and at least one electrical contact lug, comprising:
A method in accordance with 37, further comprising repeating said applying of the electrical insulating film until the film thickness is obtained.
Dependencies are inferred from the claim text.