Dicing method and dicing device
AssigneeSeiko Instruments Inc.
InventorKiyoaki Kadoi
Life of this patent
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Abstract
A dicing blade (2) which rotates at high speed is surrounded by a case (3). A semiconductor wafer (1) is cut by a dicing device in which the case is filled with a cooling water (4). The case (3) is provided with a cooling water nozzle (8) for continuously supplying the cooling water and a gap (10) for discharging the cooling water out of the case. By adjusting a supply rate and a discharge rate of the cooling water, a proper water pressure can be applied to an inside of the case, thereby making it possible to cool the dicing blade and the cutting point with efficiency. As a result, it is possible to suppress chipping and cracking of the semiconductor device due to lack of cooling.
Claims6
A dicing method of cutting a semiconductor wafer by a dicing blade which rotates at high speed comprising:
- surrounding the dicing blade by a case;
- filling an inside of the case with a cooling water;
- and
- cutting the wafer while cooling the dicing blade and a cutting point.
A dicing device for cutting a semiconductor wafer with a dicing blade which rotates at high speed comprising:
- the dicing blade;
- a case surrounding the dicing blade and maintaining a gap between the semiconductor wafer and the case;
- and
- a cooling water filled in the case.
A dicing device for cutting a semiconductor wafer with a dicing blade which rotates at high speed comprising:
- the dicing blade;
- a case surrounding the dicing blade and maintaining a gap between the semiconductor wafer and the case;
- a cooling water filled in the case;
- and
- a brush provided in the gap.
Dependencies are inferred from the claim text.