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US 2007/0175359 A1Published application
Electroless gold plating solution and method
OwnerKilnam Hwanginventor
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Abstract
Electroless gold plating compositions that include an adhesion enhancer compound and a reduction accelerator are provided to obtain direct electroless gold plating over a gold, nickel or nickel alloy deposit. A method of electroless gold plating on a nickel-containing substrate is also disclosed.
Claims26
An electroless gold plating solution comprising a solution-soluble gold compound, a sulfite compound in an amount sufficient to act as a complexing agent and reducing agent, a thiosulfate compound as a plating initiator, and a solution-soluble mercapto-based organic adhesion enhancer of the formula:
- XOC(CH2)nCHSHCOY
- wherein X and Y independently are a hydroxyl, amine, or halide group or a monovalent cation and n is 1 to 5 in an amount sufficient to enhance adhesion of the electroless gold deposit to a substrate.
Dependencies are inferred from the claim text.