Electroless gold plating solution
OwnerKilnam Hwanginventor
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Abstract
An electroless gold plating solution that includes a solution- or water-soluble gold compound that provides gold ions, a complexing agent for the gold ions comprising a mixture of a sulfite and a thiosulfate in a weight ratio of greater than 1:2 to 50: 1, a reducing agent, and a benzoic acid compound having one to four hydroxyl group(s) or a solution- or water-soluble salt thereof in an amount sufficient to act as a stabilizer for the solution. Also disclosed are methods for electrolessly plating gold on a substrate or article.
Claims20
An electroless gold plating solution comprising a solution-soluble gold compound that provides gold ions, a complexing agent for the gold ions comprising a mixture of a sulfite compound and a thiosulfate compound in a weight ratio of greater than 1:2 to 50:1, a reducing agent, and a benzoic acid compound having one to four hydroxyl group(s) or a solution-soluble salt thereof in an amount sufficient to act as a stabilizer for the solution.
Dependencies are inferred from the claim text.