Off-axis illumination assembly and method
AssigneeSpeedline Technologies, Inc.
InventorDavid Prince
Life of this patent
Estimating the term…
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AssigneeSpeedline Technologies, Inc.
InventorDavid Prince
Estimating the term…
A stencil printer is provided for depositing solder paste onto a surface of an electronic substrate. The stencil printer includes a frame and a stencil coupled to the frame. The stencil has a plurality of apertures formed therein. The stencil printer further includes a dispenser coupled to the frame. The stencil and the dispenser are adapted to deposit solder paste onto the electronic substrate. The stencil printer further includes an imaging system constructed and arranged to capture an image of the electronic substrate. The imaging system includes a camera assembly, an on-axis illumination assembly adapted to generate light substantially along a first axis generally perpendicular to the surface of the electronic substrate, and an off-axis illumination assembly adapted to generate rays of light substantially along a second axis extending at an angle with respect to the first axis. A controller is coupled to the imaging system to control movement of the imaging system to capture an image.
A stencil printer for depositing solder paste onto a surface of an electronic substrate, the stencil printer comprising:
An imaging system for capturing an image of a surface of an electronic substrate, the imaging system comprising:
A method for dispensing solder paste onto a surface of an electronic substrate, the method comprising:
A stencil printer for depositing solder paste onto a surface of an electronic substrate, the stencil printer comprising:
Dependencies are inferred from the claim text.